A giant object that has been lurking in the relative galactic vicinity of the Solar System this entire time has just been unmasked in all its enormous, invisible glory.
Just 300 light-years away, at the edge of the Local Bubble of space, astronomers have discovered a huge, crescent-shaped cloud of molecular hydrogen, the basic building block of everything in the Universe.
It’s the first time scientists have managed to discover molecular material in interstellar space by looking for the glow of far-ultraviolet light. Its discoverers have named the cloud Eos, after the ancient Greek goddess of the dawn.
Lithium button cells with electrodes made of nickel-manganese-cobalt oxides (NMC) are very powerful. Unfortunately, their capacity decreases over time. Now, for the first time, a team has used a non-destructive method to observe how the elemental composition of the individual layers in a button cell changes during charging cycles.
The study, published in the journal Small, involved teams from the Physikalisch-Technische Bundesanstalt (PTB), the University of Münster, researchers from the SyncLab research group at HZB and the BLiX laboratory at the Technical University of Berlin. Measurements were carried out in the BLiX laboratory and at the BESSY II synchrotron radiation source.
Lithium-ion batteries have become increasingly better. The combination of layered nickel-manganese-cobalt oxides (NMC) with a graphite electrode (anode) has been well established as the cathode material in button cells and has been continuously improved. However, even the best batteries do not last forever; they age and lose capacity over time.
As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow high-performance processors, like those used for artificial intelligence, to be packaged closely with other highly specialized chips for communication or imaging. But technologists everywhere face a major challenge: how to prevent these stacks from overheating.
Now, MIT Lincoln Laboratory has developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, mimicking high-performance logic chips, to generate heat through the silicon layer and in localized hot spots. Then, as cooling technologies are applied to the packaged stack, the chip measures temperature changes. When sandwiched in a stack, the chip will allow researchers to study how heat moves through stack layers and benchmark progress in keeping them cool.
“If you have just a single chip, you can cool it from above or below. But if you start stacking several chips on top of each other, the heat has nowhere to escape. No cooling methods exist today that allow industry to stack multiples of these really high-performance chips,” says Chenson Chen, who led the development of the chip with Ryan Keech, both of the laboratory’s Advanced Materials and Microsystems Group.
The evolution of wireless communications and the miniaturization of electrical circuits have fundamentally reshaped our lives and the digital landscape. However, as we push toward higher-frequency communications in an increasingly connected world, engineers face growing challenges from multipath propagation—a phenomenon where the same radio signal reaches receiving antennas through multiple routes, usually with time delays and altered amplitudes.
Multipath interference leads to many reliability issues, ranging from “ghosting” in television broadcasts to signal fading in wireless communications.
Addressing multipath interference has long presented two fundamental physical challenges. First, multipath signals share the same frequency with the main (leading) signal, rendering conventional frequency-based filtering techniques ineffective. Second, the incident angles of these signals are variable and unpredictable. These limitations have made passive solutions particularly difficult to implement, as traditional materials bound by linear time-invariant (LTI) responses maintain the same scattering profile for a given frequency, regardless of when the signal arrives.
He Qinglin’s group at the Center for Quantum Materials Science, School of Physics, has reported the first observation of non-reciprocal Coulomb drag in Chern insulators. This breakthrough opens new pathways for exploring Coulomb interactions in magnetic topological systems and enhances our understanding of quantum states in such materials. The work was published in Nature Communications.
Coulomb drag arises when a current in one conductor induces a measurable voltage in a nearby, electrically insulated conductor via long-range Coulomb interactions.
Chern insulators are magnetic topological materials that show a quantized Hall effect without external magnetic fields, due to intrinsic magnetization and chiral edge states.
A squishy, layered material that dramatically transforms under pressure could someday help computers store more data with less energy.
That’s according to a new study by researchers at Washington State University and the University of North Carolina at Charlotte that shows a hybrid zinc telluride-based material can undergo surprising structural changes when squeezed together like a molecular sandwich. Those changes could make it a strong candidate for phase change memory, a type of ultra-fast, long-lasting data storage that works differently than the memory found in today’s devices and doesn’t need a constant power source.
The research was made possible by a X-ray diffraction system that was acquired in 2022. This specialized equipment lets researchers observe tiny structural changes in the material as they happened—all from WSU’s Pullman campus. Usually, these kinds of experiments require time at massive national facilities like the Advanced Light Source at Berkeley National Laboratory in California.
