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Scientists have re-investigated a sixty-year-old idea by an American physicist and provided new insights into the quantum world.

The research, which took seven years to complete, could lead to improved , laser techniques, interferometric high-precision measurements and atomic beam applications.

Quantum physics is the study of everything around us at the atomic level, , electrons and particles. Atoms and electrons which are so small, one billion placed side by side could fit within a centimeter. Because of the way atoms and electrons behave, scientists describe their behavior as like waves.

Circa 2017


Quantum computing is the next big technological revolution, and it’s coming sooner than you might think. IBM unveiled its own quantum processor this past May, scientists have been experimenting with silicon-laced diamonds (and basic silicon, too) as a quantum computing substrate, Google is already looking at cloud-based solutions and Microsoft is already creating a new coding language for the technology. Now Intel has taken another big step towards a quantum computing reality: the company has created a new superconducting chip using advanced material science and manufacturing techniques, and delivered it to Intel’s research partner in the Netherlands, QuTech.

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As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate interconnect crowding. Through-silicon vias (TSVs) represent a promising approach to three-dimensional (3D) integration in superconducting qubit arrays—provided they are compact enough to support densely-packed qubit systems without compromising qubit performance or low-loss signal and control routing. In this work, we demonstrate the integration of superconducting, high-aspect ratio TSVs—10 μm wide by 20 μm long by 200 μm deep—with superconducting qubits. We utilize TSVs for baseband control and high-fidelity microwave readout of qubits using a two-chip, bump-bonded architecture. We also validate the fabrication of qubits directly upon the surface of a TSV-integrated chip. These key 3D-integration milestones pave the way for the control and readout of high-density superconducting qubit arrays using superconducting TSVs.

(Nanowerk News) Quantum technology holds great promise: Just a few years from now, quantum computers are expected to revolutionize database searches, AI systems, and computational simulations. Today already, quantum cryptography can guarantee absolutely secure data transfer, albeit with limitations. The greatest possible compatibility with our current silicon-based electronics will be a key advantage. And that is precisely where physicists from the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) and TU Dresden have made remarkable progress: The team has designed a silicon-based light source to generate single photons that propagate well in glass fibers.

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BT and Toshiba have deployed an ‘unhackable’ quantum network that uses streams of photons to encrypt sensitive communications.

A trial of the network, which is the first of its kind in the UK, will see data transmitted between two engineering facilities in Bristol using encryption keys streamed as ‘encoded’ particles of light.

Technion researchers have developed accurate radiation sources that are expected to lead to breakthroughs in medical imaging and other areas. They have developed precise radiation sources that may replace the expensive and cumbersome facilities currently used for such tasks. The suggested apparatus produces controlled radiation with a narrow spectrum that can be tuned with high resolution, at a relatively low energy investment. The findings are likely to lead to breakthroughs in a variety of fields, including the analysis of chemicals and biological materials, medical imaging, X-ray equipment for security screening, and other uses of accurate X-ray sources.

Published in the journal Nature Photonics, the study was led by Professor Ido Kaminer and his master’s student Michael Shentcis as part of a collaboration with several research institutes at the Technion: the Andrew and Erna Viterbi Faculty of Electrical Engineering, the Solid State Institute, the Russell Berrie Nanotechnology Institute (RBNI), and the Helen Diller Center for Quantum Science, Matter and Engineering.

The researchers’ paper shows an experimental observation that provides the first proof-of-concept for theoretical models developed over the last decade in a series of constitutive articles. The first article on the subject also appeared in Nature Photonics. Written by Prof. Kaminer during his postdoc at MIT, under the supervision of Prof. Marin Soljacic and Prof. John Joannopoulos, that paper presented theoretically how two-dimensional materials can create X-rays. According to Prof. Kaminer, “that article marked the beginning of a journey towards sources based on the unique physics of two-dimensional materials and their various combinations—heterostructures. We have built on the theoretical breakthrough from that article to develop a series of follow-up articles, and now, we are excited to announce the first experimental observation on the creation of X-ray radiation from such materials, while precisely controlling the radiation parameters.”