Toggle light / dark theme

Even the most complicated data processing on a computer can be broken down into small, simple logical steps: You can add individual bits together, you can reverse logical states, you can use combinations such as “AND” or “OR.” Such operations are realized on the computer by very specific sets of transistors. These sets then form larger circuit blocks that carry out more complex data manipulations.

MIT ’s breakthrough in integrating 2D materials into devices paves the way for next-generation devices with unique optical and electronic properties.

Two-dimensional materials, which are only a few atoms thick, can exhibit some incredible properties, such as the ability to carry electric charge extremely efficiently, which could boost the performance of next-generation electronic devices.

But integrating 2D materials into devices and systems like computer chips is notoriously difficult. These ultrathin structures can be damaged by conventional fabrication techniques, which often rely on the use of chemicals, high temperatures, or destructive processes like etching.

Excitement about the era of Quantum Error Correction is reaching a fever pitch.


By Prof Michael J Biercuk, CEO and Founder, Q-CTRL

Excitement about the era of Quantum Error Correction (QEC) is reaching a fever pitch. This has been a topic under development for many years by academics and government agencies as QEC is a foundational concept in quantum computing.

More recently, industry roadmaps have not only openly embraced QEC, but hardware teams have also started to show convincing demonstrations that it can really be implemented to address the fundamental roadblock for quantum computing – hardware noise and error. This rapid progress has upended notions that the sector could be stagnating in so-called NISQ era, and reset expectations among observers.

“The goal is to make all these parts work together effectively on a single platform, which would greatly reduce the loss of signals and remove the need for extra technology,” said Quinlan. “Phase one of this project was to show that all these individual pieces work together. Phase two is putting them together on the chip,” he added.

A team of researchers from several prestigious institutions helped NIST with this amazing achievement. These included the University of Colorado Boulder, the NASA Jet Propulsion Laboratory, the California Institute of Technology, the University of California Santa Barbara, the University of Virginia, and Yale University.

“I like to compare our research to a construction project. There are a lot of moving parts, and you need to make sure everyone is coordinated so the plumber and electrician show up at the right time in the project,” said Quinlan. We all work together really well to keep things moving forward,” he added.

A team of researchers at Cornell University has created a semiconductor chip that will allow ever-tinier devices to function at the higher frequencies required for the next generation of 6G communication technology.

In addition to requiring more bandwidth at higher frequencies, the next generation of wireless communication also demands more time. According to researchers, the new semiconductor provides the appropriate time delay to prevent signals from dissolving at a single point in space after being relayed over numerous arrays.