A revolution is underway in the development of autonomous wireless sensors, low-power consumer electronics, smart homes, domotics and the Internet of Things. All the related technologies require efficient and easy-to-integrate energy harvesting devices for their power. Billions of wireless sensors are expected to be installed in interior environments in coming decades.
Waves, whether they are light waves, sound waves, or any other kind, travel in the same manner in forward and reverse directions—this is known as the principle of reciprocity. If we could route waves in one direction only—breaking reciprocity—we could transform a number of applications important in our daily lives. Breaking reciprocity would allow us to build novel “one-way” components such as circulators and isolators that enable two-way communication, which could double the data capacity of today’s wireless networks. These components are essential to quantum computers, where one wants to read a qubit without disturbing it. They are also critical to radar systems, whether in self-driving cars or those used by the military.
A team led by Harish Krishnaswamy, professor of electrical engineering, is the first to build a high-performance non-reciprocal device on a compact chip with a performance 25 times better than previous work. Power handling is one of the most important metrics for these circulators and Krishnaswamy’s new chip can handle several watts of power, enough for cellphone transmitters that put out a watt or so of power. The new chip was the leading performer in a DARPA SPAR (Signal Processing at RF) program to miniaturize these devices and improve performance metrics. Krishnaswamy’s group was the only one to integrate these non-reciprocal devices on a compact chip and also demonstrate performance metrics that were orders of magnitude superior to prior work. The study was presented in a paper at the IEEE International Solid-State Circuits Conference in February 2020, and published May 4, 2020, in Nature Electronics.
“For these circulators to be used in practical applications, they need to be able to handle watts of power without breaking a sweat,” says Krishnaswamy, whose research focuses on developing integrated electronic technologies for new high-frequency wireless applications. “Our earlier work performed at a rate 25 times lower than this new one—our 2017 device was an exciting scientific curiosity but it was not ready for prime time. Now we’ve figured out how to build these one-way devices in a compact chip, thus enabling them to become small, low cost, and widespread. This will transform all kinds of electronic applications, from VR headsets to 5G cellular networks to quantum computers.”
WASHINGTON — The U.S. Army will experiment using Starlink broadband to move data across military networks. An agreement signed with SpaceX on May 20 gives the Army three years to try out the service.
The Army and SpaceX signed a Cooperative Research and Development Agreement known as a CRADA, an Army source told SpaceNews.
The project will be overseen by the Combat Capabilities Development Command’s C5ISR Center based at Aberdeen Proving Ground, Maryland.
Researchers in Australia have achieved a world record internet speed of 44.2 terabits per second, allowing users to download 1,000 HD movies in a single second.
A team from Monash, Swinburne and RMIT universities used a “micro-comb” optical chip containing hundreds of infrared lasers to transfer data across existing communications infrastructure in Melbourne.
Circa 2017
Electric car purchases have been on the rise lately, posting an estimated 60 percent growth rate last year. They’re poised for rapid adoption by 2022, when EVs are projected to cost the same as internal combustion cars. However, these estimates all presume the incumbent lithium-ion battery remains the go-to EV power source. So, when researchers this week at the University of Texas at Austin unveiled a new, promising lithium- or sodium–glass battery technology, it threatened to accelerate even rosy projections for battery-powered cars.
“I think we have the possibility of doing what we’ve been trying to do for the last 20 years,” says John Goodenough, coinventor of the now ubiquitous lithium-ion battery and emeritus professor at the Cockrell School of Engineering at the University of Texas, Austin. “That is, to get an electric car that will be competitive in cost and convenience with the internal combustion engine.” Goodenough added that this new battery technology could also store intermittent solar and wind power on the electric grid.
Yet, the world has seen alleged game-changing battery breakthroughs come to naught before. In 2014, for instance, Japanese researchers offered up a cotton–based (!) new battery design that was touted as “energy dense, reliable, safe, and sustainable.” And if the cotton battery is still going to change the world, its promoters could certainly use a new wave of press and media releases, as an Internet search on their technology today produces links that are no more current than 2014–2015 vintage.
As Internet of Things (IoT) devices rapidly increase in popularity and deployment, economic attackers and nation-states alike are shifting their attention to the vulnerabilities of digital integrated circuit (IC) chips. Threats to IC chips are well known, and despite various measures designed to mitigate them, hardware developers have largely been slow to implement security solutions due to limited expertise, high cost and complexity, and lack of security-oriented design tools integrated with supporting semiconductor intellectual property (IP). Further, when unsecure circuits are used in critical systems, the lack of embedded countermeasures exposes them to exploitation. To address the growing threat this poses from an economic and national security perspective, DARPA developed the Automatic Implementation of Secure Silicon (AISS) program. AISS aims to automate the process of incorporating scalable defense mechanisms into chip designs, while allowing designers to explore chip economics versus security trade-offs based on the expected application and intent while maximizing designer productivity.
Today, DARPA is announcing the research teams selected to take on AISS’ technical challenges. Two teams of academic, commercial, and defense industry researchers and engineers will explore the development of a novel design tool and IP ecosystem – which includes tool vendors, chip developers, and IP licensors – allowing, eventually, defenses to be incorporated efficiently into chip designs. The expected AISS technologies could enable hardware developers to not only integrate the appropriate level of state-of-the-art security based on the target application, but also balance security with economic considerations like power consumption, die area, and performance.
“The ultimate goal of the AISS program is to accelerate the timeline from architecture to security-hardened RTL from one year, to one week – and to do so at a substantially reduced cost,” said the DARPA program manager leading AISS, Mr. Serge Leef.