Lifeboat Foundation

A new patent filed by Apple could offer a glimpse into the future of MacBook design, and it would be a much less tactile experience. The patent for a “Configurable Force-Sensitive Input Structure for Electronic Devices” was filed in September 2014 and was made available to the public last week. It describes a haptic-powered touch keyboard for devices like laptops. Such a device wouldn’t have any physical key switches, just a touch-sensitive layer with virtual keys.

The system would essentially consist of a large metal contact layer with the ability to sense not just touches, but the amount of force applied — 3D Touch, basically. The user would tap a key, which is really just a configurable area of the surface, and they get a haptic jolt to simulate pressing a key. The array of keys on the virtual keyboard would be marked by a light guide shining up from underneath.

Apple files patents on plenty of things that never see the light of day, but this seems like something it might want to use. Of course, that assumes it can get anywhere close to a real typing experience in terms of speed and accuracy. The company is constantly trying to slim down its MacBooks, to the point that it went all-in with USB Type-C on the latest MacBook Air. The keyboard is one of the thickest single components of the device now. If the physical keys could be done away with, the computer could approach tablet levels of thinness.

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Mercedes S Class Driverless Car Is Here 2015 Commercial Self Driving Mercedes S Class W222. As the inventor of the automobile, Mercedes-Benz natural assumes a pioneering role where autonomous driving is concerned. The declared aim is to develop the automobile further, from a self-moving (“automobile”) vehicle to an independent (“autonomous”) vehicle. In its research and development activities, Mercedes-Benz goes well beyond purely technical realisation of automated driving and anticipates various scenarios.

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The breakthrough could change gadgets for good.

Creative approach and I like it. I advise IT leaders, developers, architects, etc. to start learning as much as they can about Quantum Technology because technology in the next 6 to 7 years will begin the accelerated adoption of this technology and at that point it will be too late for folks in tech to catch up. Now is the time to learn and keep track of the progression of this technology as well as understand where and how this technology can be leveraged earlier in various areas of the infrastructure, devices, and even in industry.

Researchers gave internet users games that simulate quantum physics experiments, and internet users gave the researchers more elegant solutions.

Research scientists at INM have combined the benefits of organic and inorganic electronic materials in a new type of hybrid inks. This allows electronic circuits to be applied to paper directly from a pen, for example.

The electronics of the future will be printed. Flexible circuits can be produced inexpensively on foil or paper using printing processes and permit futuristic designs with curved diodes or input elements. This requires printable electronic materials that can be printed and retain a high level of conductivity during usage in spite of their curved surfaces. Some tried and tested materials include organic, conductive polymers and nanoparticles made of conductive oxides (TCOs). Research scientists at INM – Leibniz-Institute for New Materials have now combined the benefits of organic and inorganic electronic materials in a new type of hybrid inks. This allows electronic circuits to be applied to paper directly from a pen, for example.

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The question is what does Stefano Pirandola and Samuel L. Braunstein consider “hybrid” when it comes to QC? In much of the Quantum research today only shows us things like “synthetic diamonds”, etc. are added to stablize data storage and transmissions not much else.

Physics: Unite to build a quantum Internet. Braunstein.

With 3D printers; many small mom-and-pop manufacturers are easy to set up anywhere. Which brings in some interesting challenges when thinking about regulatory compliance and safety. Imaging a neighbor who was laid off gets a 3D printer and begins building and shipping things from their home. Plus they’re stock piling chemicals and other things in their basement or garage as “bi-products” in the production of the goods that they are building with their $15K 3D printer. Question for many is — how safe is it? how can this be monitored and controlled?

Manufacturers haven’t been able to fully exploit advancements in new materials, because computer-aided design and engineering tools haven’t kept pace, says a program manager for the government agency.

Continue reading “DARPA Project to Seek Lightyear-Like Leap in Design, Manufacturing” »

“DNA base pairing has been used for many years to direct the arrangement of inorganic nanocrystals into small groupings and arrays with tailored optical and electrical properties. The control of DNA-mediated assembly depends crucially on a better understanding of three-dimensional structure of DNA-nanocrystal-hybridized building blocks. Existing techniques do not allow for structural determination of these flexible and heterogeneous samples.”

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When I read articles like this one; I wonder if folks really fully understand the full impact of what Quantum brings to all things in our current daily lives.

The high performance computing market is going through a technology transition – the Co-Design transition. As has already been discussed in many articles, this transition has emerged in order to solve the performance bottlenecks of today’s infrastructures and applications, performance bottlenecks that were created by multi-core CPUs and the existing CPU-centric system architecture.

How are multi-core CPUs the source for today’s performance bottlenecks? In order to understand that, we need to go back in time to the era of single-core CPUs. Back then, performance gains came from increases in CPU frequency and from the reduction of networking functions (network adapter and switches). Each new generation of product brought faster CPUs and lower-latency network adapters and switches, and that combination was the main performance factor. But this could not continue forever. The CPU frequency could not be increased any more due to power limitations, and instead of increasing the speed of the application process, we began using more CPU cores in parallel, thereby executing more processes at the same time. This enabled us to continue improving application performance, not by running faster, but by running more at the same time.

Continue reading “The Ultimate Debate – Interconnect Offloading Versus Onloading” »