TSMC’s dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers now face mounting pressure to diversify supply chains due to cost and capacity constraints, accelerating the shift toward multi-sourcing strategies.

Recent supply chain reports reveal that Nvidia, alongside Apple, plans to collaborate with Intel on its 2028 Feynman architecture platform. Both companies are targeting “low volume, low-tier, non-core” production runs to align with Trump administration directives while preserving their core TSMC(2330.TW) relationships. This dual-foundry approach is designed to minimize mass production risks while satisfying political pressures.