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AI-Powered Discovery of High-Performance Polymers for Heat Dissipation

In a groundbreaking step forward for polymer science and electronics cooling technology, researchers from Japan have leveraged artificial intelligence to identify a new class of liquid crystalline polyimides with remarkably high thermal conductivity. Their work, recently published in npj Computational Materials, combines data science, chemistry, and machine learning to accelerate the search for next-generation materials capable of efficiently dissipating heat in compact, high-performance electronics.

🔗 Original article on Phys.org

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