Alongside their EPYC server CPU updates, as part of today’s AMD Data Center event, the company is also offering an update on the status of their nearly-finished AMD Instinct MI300 accelerator family. The company’s next-generation HPC-class processors, which use both Zen 4 CPU cores and CDNA 3 GPU cores on a single package, have now become a multi-SKU family of XPUs.
Joining the previously announced 128GB MI300 APU, which is now being called the MI300A, AMD is also producing a pure GPU part using the same design. This chip, dubbed the MI300X, uses just CDNA 3 GPU tiles rather than a mix of CPU and GPU tiles in the MI300A, making it a pure, high-performance GPU that gets paired with 192GB of HBM3 memory. Aimed squarely at the large language model market, the MI300X is designed for customers who need all the memory capacity they can get to run the largest of models.
First announced back in June of last year, and detailed in greater depth back at CES 2023, the AMD Instinct MI300 is AMD’s big play into the AI and HPC market. The unique, server-grade APU packs both Zen 4 CPU cores and CDNA 3 GPU cores on to a single, chiplet-based chip. None of AMD’s competitors have (or will have) a combined CPU+GPU product like the MI300 series this year, so it gives AMD an interesting solution with a truly united memory architecture, and plenty of bandwidth between the CPU and GPU tiles.
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