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Dec 3, 2021

Alibaba’s DAMO Academy Successfully Develops World’s First 3D Stacked In-Memory Computing Chip Based on DRAM

Posted by in categories: innovation, robotics/AI

On Friday, Alibaba Cloud announced in a social media post that its DAMO Academy has successfully developed a 3D stacked In-Memory Computing (IMC) chip.

Alibaba Cloud claims this is a breakthrough that can help overcome the von Neumann bottleneck, a limitation on throughput caused by the standard personal computer architecture. It meets the needs of artificial intelligence (AI) and other scenarios for high bandwidth, high capacity memory and extreme computing power. In the specific AI scenario tested by Alibaba, the performance of the chip is improved by more than 10 times.

With the outbreak of AI applications, the shortcomings of the existing computer system architecture are gradually revealed. The main problems are that, on the one hand, processing data brings huge energy consumption. Under the traditional architecture, the power consumption required for data transmission from memory unit to computing unit is about 200 times of that of computing itself, so the real energy consumption and time used for computing are very low.

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