Jul 19, 2016
DARPA tackling reusable, modular chipset technology
Posted by Karen Hurst in categories: computing, electronics
More information on DARPA’s efforts in build new interface standards for modular design & practical circuit blocks.
Is it possible to develop chip technology that combines the high-performance characteristics of ASICS with the speedy, low-cost features of printed circuit boards?
Scientists at the Defense Advanced Research Projects Agency this week said they were looking for information on how to build interface standards that would enable modular design and practical circuit blocks that could be reused to greatly shorten electronics development time and cost.
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