Dec 9, 2024
Intel Foundry Unveils “Innovative” Strategies For Transistors & Packaging Technologies, Enhancing Silicon Scalability
Posted by Genevieve Klien in categories: computing, materials
Intel Foundry has showcased “breakthrough” developments in the realm of transistor and packaging technologies, revealing material and silicon innovation.
Intel Foundry Showcases “Subtractive Ruthenium” & New Transistor Technologies To Ensure Node Scalability
[Press Release]: Today at the IEEE International Electron Devices Meeting (IEDM) 2024, Intel Foundry unveiled breakthroughs to help drive the semiconductor industry forward into the next decade and beyond. Intel Foundry showcased new material advancements that help improve interconnections within a chip, resulting in up to 25% capacitance by using subtractive ruthenium.