Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits—tiny chips that convey information using light instead of electricity—so they can survive and operate in extreme environments, from scorchingly hot industrial settings to ultracold vacuum chambers and the depths of outer space.

“Our study marks a major step toward bringing the speed and efficiency of photonics into environments where conventional semiconductor chips powered by electric current and photonics chips packaged using traditional methods have not been able to operate,” said NIST physicist Nikolai Klimov, who led the project. The results were just published in Photonics Research.