Today’s high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs to meet soaring demands for performance and memory bandwidth. TSMC’s current CoWoS solutions can accommodate interposers up to 2,831 mm², more than three times the size of a standard photomask reticle, which is limited to 830 – 858 mm² by EUV lithography constraints.