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Jan 7, 2025

Thin, Fast, and Powerful: MIT’s “Stacked” 3D Chips Shatter Industry Constraints

Posted by in category: robotics/AI

An electronic stacking technique has the potential to exponentially boost the number of transistors on chips, paving the way for more efficient AI hardware.

The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So, chip manufacturers are looking to build up rather than out.

Instead of squeezing ever-smaller transistors onto a single surface, the industry is aiming to stack multiple surfaces of transistors and semiconducting elements — akin to turning a ranch house into a high-rise. Such multilayered chips could handle exponentially more data and carry out many more complex functions than today’s electronics.

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