Tackling heat transfer, diamond layers help build 3D circuits with lower power consumption, faster signaling, and increased performance.
Scientists have discovered that adding diamond layers to computer chips significantly boosts heat transfer, paving the way for faster, more powerful computers.
Their research revealed that this combination improves heat transfer by tenfold, a feat that could lead to more efficient designs like 3D circuits, where electronic components are stacked vertically, and heterogeneous integration, which combines different types of components in a single chip.
Leave a reply