Solutions are needed early as thermal becomes a systems issue.
Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate.
Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on how devices are used, how often and where they are used, and by the diameter of the wires used in a particular design, or even a particular area of a chip or package. It’s not unusual for systems to throttle back performance because some circuits are running too hot.
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