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Nov 11, 2021

Samsung’s H-Cube solution to allow efficient integration of 6 HBMs, and lower cost benefit

Posted by in category: robotics/AI

Samsung Electro-Mechanics (SEMCO) and Amkor Technology have partnered to develop a 2.5D Integration ‘H-Cube’ solution specialized for semiconductors for HPC, AI, data center, and network products.

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