Lifeboat Foundation

Good news electric vehicle enthusiasts, Tesla owners, and Elon Musk fanboys: Musk has announced that he’s working on Tesla Master Plan Part 3.

“Looks like Musk enjoyed @danahull’s latest @hyper_drive newsletter column reflecting on Tesla’s master plans and its missing affordable EVs. https://bloom.bg/3667rlp”

Rice University researchers have tested a tiny lensless microscope called Bio-FlatScope, capable of producing high levels of detail in living samples. The team imaged plants, hydra, and, to a limited extent, a human.

A previous iteration of the technology, FlatCam, was a lensless device that channeled light through a mask and directly onto a camera sensor, aimed primarily outward at the world at large. The raw images looked like static, but a custom algorithm translated the raw data into focused images.

The device described in current research looks inward to image micron-scale targets such as cells and blood vessels inside the body, and even through skin. The technology combines a sophisticated phase mask to generate patterns of light that fall directly onto the chip, the researchers said. The mask in the original FlatCam looked like a barcode and limited the amount of light that passes through to the sensor.

From a performance standpoint we know building a homebrew Raspberry Pi cluster doesn’t make a lot of sense, as even a fairly run of the mill desktop x86 machine is sure to run circles around it. That said, there’s an argument to be made that rigging up a dozen little Linux boards gives you a compact and affordable playground to experiment with things like parallel computing and load balancing. Is it a perfect argument? Not really. But if you’re anything like us, the whole thing starts making a lot more sense when you realize your cluster of Pi Zeros can be built to look like the iconic Cray-1 supercomputer.

Continue reading “Cluster Your Pi Zeros In Style With 3D Printed Cray-1” »

A team of researchers affiliated with multiple institutions in China and the U.S. has found that it is possible to track the sliding of grain boundaries in some metals at the atomic scale using an electron microscope and an automatic atom tracker. In their paper published in the journal Science, the group describes their study of platinum using their new technique and the discovery they made in doing so.

Scientists have been studying the properties of metals for many years. Learning more about how crystal grains in certain metals interact with one another has led to the development of new kinds of metals and applications for their use. In their recent effort, the researchers took a novel approach to studying the sliding that occurs between grains and in so doing have learned something new.

When crystalline metals are deformed, the grains that they are made of move against one another, and the way they move determines many of their properties, such as malleability. To learn more about what happens between grains in such metals during deformity, the researchers used two types of technologies: transmission electron microscopy and automated atom-tracking.

There’s been a lot of focus on how both Intel and AMD are planning for the future in packaging their dies to increase overall performance and mitigate higher manufacturing costs. For AMD, that next step has been V-cache, an additional L3 cache (SRAM) chiplet that’s designed to be 3D die stacked on top of an existing Zen 3 chiplet, tripling the total about of L3 cache available. Today, AMD’s V-cache technology is finally available to the wider market, as AMD is announcing that their EPYC 7003X “Milan-X” server CPUs have now reached general availability.

As first announced late last year, AMD is bringing its 3D V-Cache technology to the enterprise market through Milan-X, an advanced variant of its current-generation 3rd Gen Milan-based EPYC 7,003 processors. AMD is launching four new processors ranging from 16-cores to 64-cores, all of them with Zen 3 cores and 768 MB L3 cache via 3D stacked V-Cache.

AMD’s Milan-X processors are an upgraded version of its current 3rd generation Milan-based processors, EPYC 7003. Adding to its preexisting Milan-based EPYC 7,003 line-up, which we reviewed back in June last year, the most significant advancement from Milan-X is through its large 768 MB of L3 cache using AMD’s 3D V-Cache stacking technology. The AMD 3D V-Cache uses TSMC’s N7 process node – the same node Milan’s Zen 3 chiplets are built upon – and it measures at 36 mm², with a 64 MiB chip on top of the existing 32 MiB found on the Zen 3 chiplets.

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We’ve been hearing for years how nanotechnology is going to change the world. In movies and in headlines, nanotechnology is almost like “future magic” that will make the impossible possible. But how realistic are those predictions? And how close are we to seeing some of them come true? Let’s take a look at the state of nanotechnology.

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Continue reading “So Where Exactly Are We With Nanotechnology? | Answers With Joe” »