Researchers at the Korea Advanced Institute of Science and Technology (KAIST) have developed a technique to carve microscopic liquid-cooling channels directly inside silicon semiconductor chips.

Interestingly, the computer architecture slashed the energy required for cooling by pumping ordinary, room-temperature water straight through the chip’s internal structure.

“As the performance of AI semiconductors and advanced electronic packaging becomes increasingly limited by heat, we expect this technology to serve as a foundational cooling solution for future high-performance computing systems,” said Professor Sung Jin Kim.