Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia’s chip packaging requirements. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CoWoS-S. We will also transition the CoWoS-S capacity to CoWoS-L,” he stated.
Huang emphasized that this shift does not indicate a reduction in capacity but rather an increase in capacity for CoWoS-L technology. “So it’s not about reducing capacity. It’s actually increasing capacity into CoWoS-L,” he said.
CoWoS-L (Chip-on-Wafer-on-Substrate with Local Silicon Interconnect) represents a significant advancement over CoWoS-S in terms of performance and efficiency for high-end computing applications like AI and HPC.
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