A remarkable proof-of-concept project has successfully manufactured nanoscale diodes and transistors using a fast, cheap new production technique in which liquid metal is directed to self-assemble into precise 3D structures.
In a peer-reviewed study due to be released in the journal Materials Horizons, a North Carolina State University team outlined and demonstrated the new method using an alloy of indium, bismuth and tin, known as Field’s metal.
The liquid metal was placed beside a mold, which the researchers say can be made in any size or shape. As it’s exposed to oxygen, a thin oxide layer forms on the surface of the metal. Then, a liquid is poured onto it, containing negatively-charged ligand molecules designed to pull individual metal atoms off that oxide layer as positively-charged ions, and bind with them.
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