Bad news for anyone looking to get their hands on Nvidia’s top specced GPUs, such as the A100 or H100: it’s not going to get any easier to source the parts until at least the end of 2024, TSMC has warned. The problem, it seems, isn’t that TSMC – which fabricates not just those GPUs for Nvidia but also components for AMD, Apple, and many others – can’t make enough chips. Rather, a lack of advanced packaging capacity used to stitch the silicon together is holding up production, TSMC chairman Mark Liu told Nikkei Asia.
According to Liu, TSMC is only able to meet about 80 percent of demand for its chip on wafer on substrate (CoWoS) packaging technology. This is used in some of the most advanced… More.
Boss Mark Liu says silicon ready but advanced packaging isn’t.
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