Mar 10, 2016

Microfluidics: DARPA is betting embedded water droplets could cool next-gen chips

Posted by in categories: computing, futurism

More urgency placed on making Microfluidics/ embedded H2O droplets for cooling microchips so that the emergence of high performing microchips coming in the future.

DARPA and Lockheed Martin have a plan to build microfluidic cooling into modern microprocessors. This could dramatically improve CPU cooling and break the bottleneck on clock speed scaling — at least, for a little while.

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