{"id":29610,"date":"2016-09-01T17:32:22","date_gmt":"2016-09-02T00:32:22","guid":{"rendered":"http:\/\/lifeboat.com\/blog\/2016\/09\/continuous-roll-process-technology-for-transferring-and-packaging-flexible-large-scale-integrated-circuits"},"modified":"2017-06-04T14:18:48","modified_gmt":"2017-06-04T21:18:48","slug":"continuous-roll-process-technology-for-transferring-and-packaging-flexible-large-scale-integrated-circuits","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2016\/09\/continuous-roll-process-technology-for-transferring-and-packaging-flexible-large-scale-integrated-circuits","title":{"rendered":"Continuous Roll-process Technology for Transferring and Packaging Flexible Large-scale Integrated Circuits"},"content":{"rendered":"

<\/a><\/p>\n

Luv this.<\/p>\n

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A research team led by Professor Keon Jae Lee from the Korea<\/a> Advanced Institute of Science<\/a> and Technology (KAIST<\/a>) and by Dr. Jae-Hyun Kim from the Korea<\/a> Institute of Machinery and Materials (KIMM) has jointly developed a continuous roll-processing technology<\/a> that transfers and packages flexible large-scale integrated circuits (LSI), the key element in constructing the computer<\/a>\u2019s brain<\/a> such as CPU<\/a>, on plastics to realize flexible electronics<\/a>.<\/p>\n

Professor Lee previously demonstrated the silicon-based flexible LSIs using 0.18 CMOS<\/a> (complementary metal <\/a>-oxide semiconductor<\/a>) process in 2013 (ACS Nano<\/em>, \u201cIn Vivo<\/em> Silicon-based Flexible Radio Frequency Integrated Circuits Monolithically Encapsulated with Biocompatible Liquid Crystal Polymers<\/a>\u201d) and presented the work in an invited talk of 2015 International Electron Device Meeting (IEDM), the world\u2019s premier semiconductor<\/a> forum.<\/p>\n

Highly productive roll-processing is considered a core<\/a> technology<\/a> for accelerating the commercialization of wearable computers using flexible LSI. However, realizing it has been a difficult challenge not only from the roll-based manufacturing perspective but also for creating roll-based packaging for the interconnection of flexible LSI with flexible displays<\/a>, batteries, and other peripheral devices.<\/p>\n

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Luv this. A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has jointly developed a continuous roll-processing technology that transfers and packages flexible large-scale integrated circuits (LSI), the key element in [\u2026]<\/p>\n","protected":false},"author":395,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1523,1977],"tags":[],"class_list":["post-29610","post","type-post","status-publish","format-standard","hentry","category-computing","category-wearables"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/29610","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/395"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=29610"}],"version-history":[{"count":3,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/29610\/revisions"}],"predecessor-version":[{"id":66360,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/29610\/revisions\/66360"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=29610"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=29610"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=29610"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}