{"id":238691,"date":"2026-06-10T02:34:44","date_gmt":"2026-06-10T07:34:44","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2026\/06\/future-ai-chips-could-be-built-on-glass"},"modified":"2026-06-10T02:34:44","modified_gmt":"2026-06-10T07:34:44","slug":"future-ai-chips-could-be-built-on-glass","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2026\/06\/future-ai-chips-could-be-built-on-glass","title":{"rendered":"Future AI chips could be built on glass"},"content":{"rendered":"<p><a class=\"aligncenter blog-photo\" href=\"https:\/\/lifeboat.com\/blog.images\/future-ai-chips-could-be-built-on-glass.jpg\"><\/a><\/p>\n<p>The idea is to use glass as the substrate, or layer, on which multiple silicon chips are connected. This form of \u201cpackaging\u201d is an increasingly popular way to build computing hardware, because it lets engineers combine specialized chips designed for specific functions into a single system. But it presents challenges, including the fact that hardworking chips can run so hot they physically warp the substrate they\u2019re built on. This can lead to misaligned components and may reduce how efficiently the chips can be cooled, leading to damage or premature failure.<\/p>\n<p>\u201cAs AI workloads surge and package sizes expand, the industry is confronting very real mechanical constraints that impact the trajectory of high-performance computing,\u201d says Deepak Kulkarni, a senior fellow at the chip design company Advanced Micro Devices (AMD). \u201cOne of the most fundamental is warpage.\u201d<\/p>\n<p>That\u2019s where glass comes in. It can handle the added heat better than existing substrates, and it will let engineers keep shrinking chip packages\u2014which will make them faster and more energy efficient. It \u201cunlocks the ability to keep scaling package footprints without hitting a mechanical wall,\u201d says Kulkarni.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The idea is to use glass as the substrate, or layer, on which multiple silicon chips are connected. This form of \u201cpackaging\u201d is an increasingly popular way to build computing hardware, because it lets engineers combine specialized chips designed for specific functions into a single system. But it presents challenges, including the fact that hardworking [\u2026]<\/p>\n","protected":false},"author":513,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[20,6],"tags":[],"class_list":["post-238691","post","type-post","status-publish","format-standard","hentry","category-futurism","category-robotics-ai"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/238691","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/513"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=238691"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/238691\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=238691"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=238691"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=238691"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}