{"id":23320,"date":"2016-03-09T15:03:28","date_gmt":"2016-03-09T23:03:28","guid":{"rendered":"http:\/\/lifeboat.com\/blog\/2016\/03\/cool-technology-turns-down-the-heat-on-high-tech-equipment"},"modified":"2017-06-04T20:06:54","modified_gmt":"2017-06-05T03:06:54","slug":"cool-technology-turns-down-the-heat-on-high-tech-equipment","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2016\/03\/cool-technology-turns-down-the-heat-on-high-tech-equipment","title":{"rendered":"Cool technology turns down the heat on high-tech equipment"},"content":{"rendered":"<p><a class=\"blog-photo\" href=\"https:\/\/lifeboat.com\/blog.images\/cool-technology-turns-down-the-heat-on-high-tech-equipment.jpg\"><\/a><\/p>\n<p>Thousands of electrical components make up today\u2019s most sophisticated systems \u2013 and without innovative cooling techniques, those systems get hot. Lockheed Martin is working with the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) on its ICECool-Applications research program that could ultimately lead to a lighter, faster and cheaper way to cool high-powered microchips \u2013 by cooling the chips with microscopic drops of water.<\/p>\n<p>This technology has applications in electronic warfare, radars, high-performance computers and data servers.<\/p>\n<p>A core team of Lockheed Martin engineers is working on a solution to meet the goal of DARPA\u2019s Inter\/Intra Chip Enhanced Cooling (ICECool) program: to enhance the performance of RF MMIC power amplifiers and embedded high performance computing systems through chip-level heat removal techniques. Lockheed Martin experimentally demonstrated the effectiveness of its microfluidic cooling approach which resulted in a four-times reduction in thermal resistance and a corresponding six-times increase in RF output power when compared to conventional cooling techniques.<\/p>\n<p><!-- Link: <a href=\"http:\/\/phys.org\/news\/2016-03-cool-technology-high-tech-equipment.html\">http:\/\/phys.org\/news\/2016&#45;03-cool-technology-high-tech-equipment.html<\/a> --><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Thousands of electrical components make up today\u2019s most sophisticated systems \u2013 and without innovative cooling techniques, those systems get hot. Lockheed Martin is working with the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) on its ICECool-Applications research program that could ultimately lead to a lighter, faster and cheaper way to cool high-powered [\u2026]<\/p>\n","protected":false},"author":395,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1523,9],"tags":[],"class_list":["post-23320","post","type-post","status-publish","format-standard","hentry","category-computing","category-military"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/23320","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/395"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=23320"}],"version-history":[{"count":2,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/23320\/revisions"}],"predecessor-version":[{"id":68091,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/23320\/revisions\/68091"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=23320"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=23320"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=23320"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}