{"id":223367,"date":"2025-10-14T03:34:12","date_gmt":"2025-10-14T08:34:12","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2025\/10\/super-thin-semiconductor-overcomes-trade-off-between-speed-and-thermal-stability"},"modified":"2025-10-14T03:34:12","modified_gmt":"2025-10-14T08:34:12","slug":"super-thin-semiconductor-overcomes-trade-off-between-speed-and-thermal-stability","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2025\/10\/super-thin-semiconductor-overcomes-trade-off-between-speed-and-thermal-stability","title":{"rendered":"Super-thin semiconductor overcomes trade-off between speed and thermal stability"},"content":{"rendered":"

<\/a><\/p>\n

A team led by academician Huang Ru and Professor Wu Yanqing from the School of Integrated Circuits at Peking University has developed a super-thin, high-performance semiconductor with enhanced heat conductivity, enabled by a silicon carbide (SiC) substrate. The research, published<\/a> in Nature Electronics<\/i> under the title \u201cAmorphous indium tin oxide transistors for power amplification above 10 GHz,\u201d marks a significant step forward in next-generation radio-frequency (RF) electronics.<\/p>\n

Amorphous oxide semiconductors (AOS) enable low-temperature, large-area, and chip-compatible processing with high carrier mobility<\/a>. However, their inherently low thermal conductivity leads to self-heating effects, which limit top-gate scaling and high-frequency operation in applications such as 5G communications and the Internet of Things. Overcoming this trade-off between speed and thermal stability remains a central challenge.<\/p>\n

This breakthrough using a SiC substrate overcomes the trade-off between speed and thermal stability<\/a> in AOS, paving the way for low-cost, flexible, and chip-compatible RF electronics. It demonstrates how combining high-frequency design with effective thermal management can deliver both performance and reliability in high-speed devices.<\/p>\n","protected":false},"excerpt":{"rendered":"

A team led by academician Huang Ru and Professor Wu Yanqing from the School of Integrated Circuits at Peking University has developed a super-thin, high-performance semiconductor with enhanced heat conductivity, enabled by a silicon carbide (SiC) substrate. The research, published in Nature Electronics under the title \u201cAmorphous indium tin oxide transistors for power amplification above [\u2026]<\/p>\n","protected":false},"author":427,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1523,418],"tags":[],"class_list":["post-223367","post","type-post","status-publish","format-standard","hentry","category-computing","category-internet"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/223367","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/427"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=223367"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/223367\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=223367"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=223367"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=223367"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}