{"id":217726,"date":"2025-07-12T16:03:56","date_gmt":"2025-07-12T21:03:56","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2025\/07\/industrial-electronics"},"modified":"2025-07-12T16:03:56","modified_gmt":"2025-07-12T21:03:56","slug":"industrial-electronics","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2025\/07\/industrial-electronics","title":{"rendered":"Industrial Electronics"},"content":{"rendered":"<p><a class=\"aligncenter blog-photo\" href=\"https:\/\/lifeboat.com\/blog.images\/industrial-electronics2.jpg\"><\/a><\/p>\n<p>Growth in 2.5D and 3D packaging solutions has accelerated off-the-board technology and the components which leverage it, both in terms of the fastest digital processors but also in proprietary ASICs and application processors. As high-bandwidth digital channels approach the practical limits of copper interconnects, silicon photonics and on-PCB\/in-package optical interconnects may emerge as the next transformative wave of off-the-board technology.<\/p>\n<p>This opinion is shared by insiders within the PCB and packaging side of the industry.<\/p>\n<p>\u201cOff the board technology is growing at an amazing rate, and isn\u2019t being replaced by optical solutions, it\u2019s enabling more optical solutions,\u201d said Joe Dickson, senior VP chip-to-chip reliability and innovation at WUS PCB International. \u201cThey are not competition, they are tools to go much farther than we can today.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Growth in 2.5D and 3D packaging solutions has accelerated off-the-board technology and the components which leverage it, both in terms of the fastest digital processors but also in proprietary ASICs and application processors. As high-bandwidth digital channels approach the practical limits of copper interconnects, silicon photonics and on-PCB\/in-package optical interconnects may emerge as the next [\u2026]<\/p>\n","protected":false},"author":396,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1523,1522],"tags":[],"class_list":["post-217726","post","type-post","status-publish","format-standard","hentry","category-computing","category-innovation"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/217726","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/396"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=217726"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/217726\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=217726"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=217726"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=217726"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}