{"id":204059,"date":"2025-01-19T08:27:32","date_gmt":"2025-01-19T14:27:32","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2025\/01\/nvidia-transitions-to-advanced-cowos-l-chip-packaging-signaling-a-major-shift-for-tsmc"},"modified":"2025-01-19T08:27:32","modified_gmt":"2025-01-19T14:27:32","slug":"nvidia-transitions-to-advanced-cowos-l-chip-packaging-signaling-a-major-shift-for-tsmc","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2025\/01\/nvidia-transitions-to-advanced-cowos-l-chip-packaging-signaling-a-major-shift-for-tsmc","title":{"rendered":"Nvidia transitions to advanced CoWoS-L chip packaging, signaling a major shift for TSMC"},"content":{"rendered":"<p><a class=\"aligncenter blog-photo\" href=\"https:\/\/lifeboat.com\/blog.images\/nvidia-transitions-to-advanced-cowos-l-chip-packaging-signaling-a-major-shift-for-tsmc2.jpg\"><\/a><\/p>\n<p>Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang <a href=\"https:\/\/www.reuters.com\/technology\/nvidia-ceo-says-its-advanced-packaging-technology-needs-are-changing-2025-01-16\/\">explained<\/a> the transition in Nvidia\u2019s chip packaging requirements. \u201cAs we move into Blackwell, we will use largely CoWoS-L. Of course, we\u2019re still manufacturing Hopper, and Hopper will use CoWoS-S. We will also transition the CoWoS-S capacity to CoWoS-L,\u201d he stated.<\/p>\n<p>Huang emphasized that this shift does not indicate a reduction in capacity but rather an increase in capacity for CoWoS-L technology. \u201cSo it\u2019s not about reducing capacity. It\u2019s actually increasing capacity into CoWoS-L,\u201d he said.<\/p>\n<p>CoWoS-L (Chip-on-Wafer-on-Substrate with Local Silicon Interconnect) represents a significant advancement over CoWoS-S in terms of performance and efficiency for high-end computing applications like AI and HPC.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia\u2019s chip packaging requirements. \u201cAs we move into Blackwell, we will use largely CoWoS-L. Of course, we\u2019re still manufacturing Hopper, and Hopper will use CoWoS-S. We will also transition the CoWoS-S capacity to [\u2026]<\/p>\n","protected":false},"author":367,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[6],"tags":[],"class_list":["post-204059","post","type-post","status-publish","format-standard","hentry","category-robotics-ai"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/204059","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/367"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=204059"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/204059\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=204059"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=204059"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=204059"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}