{"id":202141,"date":"2024-12-22T07:07:56","date_gmt":"2024-12-22T13:07:56","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2024\/12\/engineers-grow-high-rise-3d-chips-enabling-more-efficient-ai-hardware"},"modified":"2024-12-22T07:07:56","modified_gmt":"2024-12-22T13:07:56","slug":"engineers-grow-high-rise-3d-chips-enabling-more-efficient-ai-hardware","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2024\/12\/engineers-grow-high-rise-3d-chips-enabling-more-efficient-ai-hardware","title":{"rendered":"Engineers grow \u2018high-rise\u2019 3D chips, enabling more efficient AI hardware"},"content":{"rendered":"<p><a class=\"aligncenter blog-photo\" href=\"https:\/\/lifeboat.com\/blog.images\/engineers-grow-high-rise-3d-chips-enabling-more-efficient-ai-hardware2.jpg\"><\/a><\/p>\n<p>The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So, chip manufacturers are looking to build up rather than out.<\/p>\n<p>Instead of squeezing ever-smaller transistors onto a single surface, the industry is aiming to stack multiple surfaces of transistors and semiconducting elements\u2014akin to turning a ranch house into a high-rise. Such multilayered chips could handle exponentially more data and carry out many more complex functions than today\u2019s electronics.<\/p>\n<p>A significant hurdle, however, is the platform on which chips are built. Today, bulky silicon wafers serve as the main scaffold on which high-quality, single-crystalline semiconducting elements are grown. Any stackable chip would have to include thick silicon \u201cflooring\u201d as part of each layer, slowing down any communication between functional semiconducting layers.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So, chip manufacturers are looking to build up rather than out. Instead of squeezing ever-smaller transistors onto a single surface, the industry is aiming to stack multiple surfaces of transistors and semiconducting [\u2026]<\/p>\n","protected":false},"author":396,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[6],"tags":[],"class_list":["post-202141","post","type-post","status-publish","format-standard","hentry","category-robotics-ai"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/202141","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/396"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=202141"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/202141\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=202141"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=202141"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=202141"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}