{"id":186695,"date":"2024-04-03T12:24:58","date_gmt":"2024-04-03T17:24:58","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2024\/04\/intel-to-build-next-generation-chips-using-glass-substrate"},"modified":"2024-04-03T12:24:58","modified_gmt":"2024-04-03T17:24:58","slug":"intel-to-build-next-generation-chips-using-glass-substrate","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2024\/04\/intel-to-build-next-generation-chips-using-glass-substrate","title":{"rendered":"Intel to Build Next-Generation Chips Using \u2018Glass Substrate\u2019"},"content":{"rendered":"<p><\/p>\n<p><iframe style=\"display: block; margin: 0 auto; width: 100%; aspect-ratio: 4\/3; object-fit: contain;\" src=\"https:\/\/www.youtube.com\/embed\/WmiQnzdSrNE?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; encrypted-media; gyroscope;\n   picture-in-picture\" allowfullscreen><\/iframe><\/p>\n<p>Year 2023 <span class=\"wp-smiley emoji emoji-face_with_colon_three\" title=\":3\">face_with_colon_three<\/span> <\/p>\n<hr>\n<p>The new manufacturing method deals with the packaging <a href=\"https:\/\/www.pcmag.com\/news\/every-die-wants-to-live-inside-fab-28-intels-elite-chip-making-site\" target=\"_self\">substrate<\/a>, the material to which chip dies are bonded. Intel and others have long used plastic (also known as organic) substrates, but the material can shrink or warp during the chip-making process, leading to defects.<\/p>\n<p>Intel notes the warping risk grows as more silicon is placed on the substrate. \u201cAs the demand for data-centric, AI-centric compute increases, we are seeing an increasing amount of silicon being packed onto the package substrate, which organic packages have come to some kind of limitation in terms of handling it,\u201d Manepalli added.<\/p>\n<p>The company found a solution in glass, a homogenous substance that can remain rigid under a higher chip load. \u201cCompared to today\u2019s organic substrates, glass offers distinctive properties such as ultra-low flatness and better thermal and mechanical stability, resulting in much higher interconnect density in a substrate,\u201d Intel said in its announcement.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Year 2023 face_with_colon_three The new manufacturing method deals with the packaging substrate, the material to which chip dies are bonded. Intel and others have long used plastic (also known as organic) substrates, but the material can shrink or warp during the chip-making process, leading to defects. Intel notes the warping risk grows as more silicon [\u2026]<\/p>\n","protected":false},"author":513,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1635,6],"tags":[],"class_list":["post-186695","post","type-post","status-publish","format-standard","hentry","category-materials","category-robotics-ai"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/186695","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/513"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=186695"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/186695\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=186695"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=186695"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=186695"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}