{"id":186291,"date":"2024-03-29T10:24:15","date_gmt":"2024-03-29T15:24:15","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2024\/03\/intel-introduces-approach-to-boost-power-efficiency-reliability-of-packaged-chiplet-ecosystems"},"modified":"2024-03-29T10:24:15","modified_gmt":"2024-03-29T15:24:15","slug":"intel-introduces-approach-to-boost-power-efficiency-reliability-of-packaged-chiplet-ecosystems","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2024\/03\/intel-introduces-approach-to-boost-power-efficiency-reliability-of-packaged-chiplet-ecosystems","title":{"rendered":"Intel introduces approach to Boost Power Efficiency, Reliability of Packaged Chiplet Ecosystems"},"content":{"rendered":"<p><a class=\"aligncenter blog-photo\" href=\"https:\/\/lifeboat.com\/blog.images\/intel-introduces-approach-to-boost-power-efficiency-reliability-of-packaged-chiplet-ecosystems3.jpg\"><\/a><\/p>\n<p>The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions. Initially, computers contained a central processor or central processing unit (CPU), connected to memory units and other components via traditional communication pathways, known as front-side-bus (FSB) interfaces.<\/p>\n<p>Technological advances, however, have enabled the development of new integrated circuit (IC) architectures relying on multiple chiplets and more sophisticated electronic components. Intel Corporation played a crucial role in these developments, by introducing new architectures and specifications for the design of systems with multiple packaged chiplets.<\/p>\n<p>Researchers at Intel Corporation Santa Clara recently outlined a new vision for further boosting the performance of systems developed following universal chiplet interconnect express (UCIe), a specification to standardize the connections between multi-function chiplets in modern System-in-Package (SiP). Their proposed approach, presented in a paper in Nature Electronics, entails reducing the frequency in these circuits to boost their power efficiency and performance.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions. Initially, computers contained a central processor or central processing unit (CPU), connected to memory units and other components via traditional communication pathways, known as front-side-bus (FSB) interfaces. Technological advances, however, have enabled [\u2026]<\/p>\n","protected":false},"author":707,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1523,1491],"tags":[],"class_list":["post-186291","post","type-post","status-publish","format-standard","hentry","category-computing","category-transportation"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/186291","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/707"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=186291"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/186291\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=186291"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=186291"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=186291"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}