{"id":135058,"date":"2022-02-01T11:24:44","date_gmt":"2022-02-01T19:24:44","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2022\/02\/next-gen-3d-chip-packaging-race-begins"},"modified":"2022-02-01T11:24:44","modified_gmt":"2022-02-01T19:24:44","slug":"next-gen-3d-chip-packaging-race-begins","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2022\/02\/next-gen-3d-chip-packaging-race-begins","title":{"rendered":"Next-Gen 3D Chip\/Packaging Race Begins"},"content":{"rendered":"<p><a class=\"aligncenter blog-photo\" href=\"https:\/\/lifeboat.com\/blog.images\/next-gen-3d-chip-packaging-race-begins2.jpg\"><\/a><\/p>\n<p>Hybrid bonding opens up whole new level of performance in packaging, but it\u2019s not the only improvement.<\/p>\n<p>The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages.<\/p>\n<p>AMD is the first vendor to unveil chips using copper hybrid bonding, an advanced die-stacking technology that enables next-generation 3D-like devices and packages. Hybrid bonding stacks and connects chips using tiny copper-to-copper interconnects, providing higher density and bandwidth than existing chip-stacking interconnect schemes.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Hybrid bonding opens up whole new level of performance in packaging, but it\u2019s not the only improvement. The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the first vendor to unveil [\u2026]<\/p>\n","protected":false},"author":396,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1523],"tags":[],"class_list":["post-135058","post","type-post","status-publish","format-standard","hentry","category-computing"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/135058","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/396"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=135058"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/135058\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=135058"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=135058"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=135058"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}