{"id":113951,"date":"2020-10-06T13:24:54","date_gmt":"2020-10-06T20:24:54","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2020\/10\/solid-state-qubits-integrated-with-superconducting-through-silicon-vias"},"modified":"2020-10-07T01:25:38","modified_gmt":"2020-10-07T08:25:38","slug":"solid-state-qubits-integrated-with-superconducting-through-silicon-vias","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2020\/10\/solid-state-qubits-integrated-with-superconducting-through-silicon-vias","title":{"rendered":"Solid-state qubits integrated with superconducting through-silicon vias"},"content":{"rendered":"<p><a class=\"aligncenter blog-photo\" href=\"https:\/\/lifeboat.com\/blog.images\/solid-state-qubits-integrated-with-superconducting-through-silicon-vias.jpg\"><\/a><\/p>\n<p>O,.o.<\/p>\n<hr>\n<p>As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate interconnect crowding. Through-silicon vias (TSVs) represent a promising approach to three-dimensional (3D) integration in superconducting qubit arrays\u2014provided they are compact enough to support densely-packed qubit systems without compromising qubit performance or low-loss signal and control routing. In this work, we demonstrate the integration of superconducting, high-aspect ratio TSVs\u201410 \u03bcm wide by 20 \u03bcm long by 200 \u03bcm deep\u2014with superconducting qubits. We utilize TSVs for baseband control and high-fidelity microwave readout of qubits using a two-chip, bump-bonded architecture. We also validate the fabrication of qubits directly upon the surface of a TSV-integrated chip. These key 3D-integration milestones pave the way for the control and readout of high-density superconducting qubit arrays using superconducting TSVs.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>O,.o. As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate interconnect crowding. Through-silicon vias (TSVs) represent a promising approach to three-dimensional (3D) integration in superconducting qubit arrays\u2014provided they are compact [\u2026]<\/p>\n","protected":false},"author":513,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1523,38,1617],"tags":[],"class_list":["post-113951","post","type-post","status-publish","format-standard","hentry","category-computing","category-engineering","category-quantum-physics"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/113951","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/513"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=113951"}],"version-history":[{"count":1,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/113951\/revisions"}],"predecessor-version":[{"id":113980,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/113951\/revisions\/113980"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=113951"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=113951"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=113951"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}