{"id":112788,"date":"2020-09-09T16:04:11","date_gmt":"2020-09-09T23:04:11","guid":{"rendered":"https:\/\/lifeboat.com\/blog\/2020\/09\/transistor-integrated-cooling-for-a-more-powerful-chip"},"modified":"2020-09-09T16:04:11","modified_gmt":"2020-09-09T23:04:11","slug":"transistor-integrated-cooling-for-a-more-powerful-chip","status":"publish","type":"post","link":"https:\/\/lifeboat.com\/blog\/2020\/09\/transistor-integrated-cooling-for-a-more-powerful-chip","title":{"rendered":"Transistor-integrated cooling for a more powerful chip"},"content":{"rendered":"

<\/a><\/p>\n

Managing the heat generated in electronics is a huge problem, especially with the constant push to reduce the size and pack as many transistors as possible in the same chip. The whole problem is how to manage such high heat fluxes efficiently. Usually, electronic technologies, designed by electrical engineers, and cooling systems, designed by mechanical engineers, are done independently and separately. But now, EPFL researchers have quietly revolutionized the process by combining these two design steps into one: They\u2019ve developed an integrated microfluidic cooling technology together with the electronics that can efficiently manage the large heat fluxes generated by transistors. Their research, which has been published in Nature<\/i>, will lead to even more compact electronic devices and enable the integration of power converters, with several high-voltage devices, into a single chip.<\/p>\n

The best of both worlds<\/b><\/p>\n

In this ERC-funded project, Professor Elison Matioli, his doctoral student Remco Van Erp, and their team from the School of Engineering\u2019s Power and Wide-band-gap Electronics Research Laboratory (POWERLAB), began working to bring about a real change in designing electronic devices<\/a> by conceiving the electronics and cooling<\/a> together, right from the beginning. The group sought to extract the heat<\/a> very near the regions that heat up the most in the device<\/a>. \u201cWe wanted to combine skills in electrical and mechanical engineering in order to create a new kind of device,\u201d says Van Erp.<\/p>\n","protected":false},"excerpt":{"rendered":"

Managing the heat generated in electronics is a huge problem, especially with the constant push to reduce the size and pack as many transistors as possible in the same chip. The whole problem is how to manage such high heat fluxes efficiently. Usually, electronic technologies, designed by electrical engineers, and cooling systems, designed by mechanical [\u2026]<\/p>\n","protected":false},"author":427,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1523,38],"tags":[],"class_list":["post-112788","post","type-post","status-publish","format-standard","hentry","category-computing","category-engineering"],"_links":{"self":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/112788","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/users\/427"}],"replies":[{"embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/comments?post=112788"}],"version-history":[{"count":0,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/posts\/112788\/revisions"}],"wp:attachment":[{"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/media?parent=112788"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/categories?post=112788"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lifeboat.com\/blog\/wp-json\/wp\/v2\/tags?post=112788"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}